Cindy Colinge

Room Temperature Wafer Bonding Using Oxygen Plasma Treatment in Reactive Ion Etchers With and Without Inductively Coupled Plasma

Anke Sanz‐Velasco, Petra Amirfeiz, Stefan Bengtsson et al. · Journal of The Electrochemical Society · 2003 · 49 citations

Engineering, Silicon On Insulator, Plasma Processing +17

Low temperature germanium to silicon direct wafer bonding using free radical exposure

Ki Yeol Byun, Isabelle Ferain, Pete Fleming et al. · Applied Physics Letters · 2010 · 42 citations · Full text

Engineering, Optoelectronic Devices, Integrated Circuits +20

A Simulation Comparison between Junctionless and Inversion-Mode MuGFETs

Jean-Pierre Colinge, Abhinav Kranti, Ran Yan et al. · ECS Transactions · 2011 · 38 citations

Engineering, Semiconductor Device, Electromagnetic Compatibility +16

Low temperature exfoliation process in hydrogen-implanted germanium layers

Isabelle Ferain, Ki Yeol Byun, Cindy Colinge et al. · Journal of Applied Physics · 2010 · 38 citations

Engineering, Hydrogen-implanted Germanium Layers, Silicon On Insulator +16

Characterization of germanium/silicon <i>p–n</i> junction fabricated by low temperature direct wafer bonding and layer exfoliation

Farzan Gity, Ki Yeol Byun, Ko-Hsin Lee et al. · Applied Physics Letters · 2012 · 34 citations

Engineering, Current Transport, Optoelectronic Devices +16