Ki Yeol Byun

Low temperature germanium to silicon direct wafer bonding using free radical exposure

Ki Yeol Byun, Isabelle Ferain, Pete Fleming et al. · Applied Physics Letters · 2010 · 42 citations · Full text

Engineering, Optoelectronic Devices, Integrated Circuits +20

Low temperature exfoliation process in hydrogen-implanted germanium layers

Isabelle Ferain, Ki Yeol Byun, Cindy Colinge et al. · Journal of Applied Physics · 2010 · 38 citations

Engineering, Hydrogen-implanted Germanium Layers, Silicon On Insulator +16

Characterization of germanium/silicon <i>p–n</i> junction fabricated by low temperature direct wafer bonding and layer exfoliation

Farzan Gity, Ki Yeol Byun, Ko-Hsin Lee et al. · Applied Physics Letters · 2012 · 34 citations

Engineering, Current Transport, Optoelectronic Devices +16

Comprehensive investigation of Ge–Si bonded interfaces using oxygen radical activation

Ki Yeol Byun, Pete Fleming, Nick S. Bennett et al. · Journal of Applied Physics · 2011 · 21 citations · Full text

Materials Science, Wafer Scale Processing, Engineering +12

Effect of Free Radical Activation for Low Temperature Si to Si Wafer Bonding

Ki Yeol Byun, Isabelle Ferain, Cindy Colinge · Journal of The Electrochemical Society · 2009 · 18 citations

Engineering, Situ Wafer Bonding, Silicon On Insulator +18