Concepedia

T. Dishongh

TD

Statistics

Publications

11

Citations

273

H-Index

10

Active since

1996

Affiliations

Intel (United States)(Current)

University of Arizona

University at Buffalo, State University of New York

T. Dishongh is an author at Intel (United States) specializing in engineering, mechanics of materials, and mechanical engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsSolid MechanicsThermal EngineeringMechanicsMechanical BehaviorStructural Mechanics

Publications per year

1996–2006

11

Publications

11

Thermomechanical behavior of micron scale solder joints under dynamic loads

Yuliang Zhao, Cemal Basaran, A. Cartwright et al. · Mechanics of Materials · 2000 · 83 citations

Materials Science, Friction Welding, Engineering +11

Innovative Circuit Board Level Routing Designs for BGA Packages

A.H. Titus, B. L. Jaiswal, T. Dishongh et al. · IEEE Transactions on Advanced Packaging · 2004 · 32 citations

Hardware Security, Electrical Engineering, Physical Design (Electronics) +12

Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation

Yuliang Zhao, Cemal Basaran, A. Cartwright et al. · Journal of the Mechanical Behavior of Materials · 1999 · 32 citations · Full text

Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints

C. S. Desai, Cemal Basaran, T. Dishongh et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1998 · 23 citations

Engineering, Mechanical Engineering, Dsc Approach +19

Evaluation of factors affecting bonding rate of calcium phosphate ceramic coatings forin vivo strain gauge attachment

John A. Szivek, P. Anderson, T. Dishongh et al. · Journal of Biomedical Materials Research · 1996 · 21 citations

Tissue Engineering, Crystal Structure, Engineering +17

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