Concepedia

A. Okuno

AO

Statistics

Publications

10

Citations

120

H-Index

10

Active since

1988

Affiliations

Panasonic (Japan)(Current)

A. Okuno is an author at Panasonic (Japan) specializing in materials science, electronic packaging, and engineering.

Top concepts

EngineeringMaterial ScienceElectronic Packaging3D PrintingAdvanced PackagingMicroelectronicsMicrofabricationComputer EngineeringElectrical EngineeringPolymer Processing

Publications per year

1988–2007

10

Publications

10

High reliability, high density, low cost packaging systems for matrix BGA and CSP using VPES (vacuum printing encapsulation systems)

A. Okuno · 2002 · 17 citations

Advanced Packaging, Materials Science, High Density +15

High reliability, high density, low cost packaging systems for matrix systems for matrix BGA and CSP by vacuum printing encapsulation systems (VPES)

A. Okuno, N. Fujita, Y. Ishikawa · IEEE Transactions on Advanced Packaging · 1999 · 16 citations

Transfer Molding, Engineering, Mechanical Engineering +16

New packaging of a chip on a board by a unique printing method

A. Okuno, K. Nagai, Ken‐ichi Ikeda et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 13 citations

Transfer Molding, Engineering, Integrated Circuits +17

Surface mount technology based on a new aramid/epoxy laminate

E. Tsunashima, A. Okuno · 1988 · 12 citations

Engineering, Organic Electronics, Surface Processing +19

New packaging of chip-on-board by unique printing method

A. Okuno, K. Nagai, Ken‐ichi Ikeda et al. · 2002 · 11 citations

Advanced Packaging, Materials Science, Chip-scale Package +12

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