R.P. Kraft

Predicting the Performance of a 3D Processor-Memory Chip Stack

Philip Jacob, Okan Erdogan, Aamir Zia et al. · IEEE Design & Test of Computers · 2005 · 59 citations

Engineering, Processor-memory Stack, Computer Architecture +16

Stacked chip-to-chip interconnections using wafer bonding technology with dielectric bonding glues

Jian‐Qiang Lu, Yongchai Kwon, R.P. Kraft et al. · 2001 · 33 citations

Engineering, Monolithic 3D, Interconnect (Integrated Circuits) +20

Improvements to X-ray laminography for automated inspection of solder joints

V. Sankaran, Andrew Kalukin, R.P. Kraft · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1998 · 33 citations

Image Analysis, Engineering, Medical Imaging +14

A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects

Jian-Qiang Lü, Yongchai Kwon, G. Rajagopalan et al. · 2003 · 28 citations

Engineering, Ic Technology Platform, Successful Wafer Alignment +18

Integration of cryocooled superconducting analog-to-digital converter and SiGe output amplifier

Deepnarayan Gupta, Alan M. Kadin, Robert J. Webber et al. · IEEE Transactions on Applied Superconductivity · 2003 · 25 citations

Electrical Engineering, Engineering, Sige Amplifiers +14