2
Publications
217
Citations
2
H-Index
1991
Active since
Affiliations
T.P. Gall is an author at Systems Technology (United States) specializing in electronic packaging, heat transfer, and flexible electronics.
Top concepts
EngineeringHeat TransferMaterial ScienceMicroelectronicsMicrofabricationThermal EngineeringElectronic PackagingFlexible ElectronicsMaterials EngineeringMechanical Engineering
Publications per year
1991–2002
2
2
Flip-chip solder bump fatigue life enhanced by polymer encapsulation
D. Suryanarayana, R. Hsiao, T.P. Gall et al. · 2002 · 88 citations
Engineering, Mechanical Engineering, Ceramic Chip Carriers +18
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