Concepedia

R. Hsiao

RH

5

Publications

300

Citations

5

H-Index

1991

Active since

Affiliations

University of California, Berkeley(Current)

Endicott College

Systems Technology (United States)

R. Hsiao is an author at University of California, Berkeley specializing in materials science, mechanical engineering, and engineering.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMaterials EngineeringApplied PhysicsCorrosionThin FilmsHeat TransferMicroelectronicsMicrofabrication

Publications per year

1991–2002

5

Publications

5

Enhancement of flip-chip fatigue life by encapsulation

D. Suryanarayana, R. Hsiao, T.P. Gall et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1991 · 129 citations

Engineering, Mechanical Engineering, Ceramic Chip Carriers +17

Flip-chip solder bump fatigue life enhanced by polymer encapsulation

D. Suryanarayana, R. Hsiao, T.P. Gall et al. · 2002 · 88 citations

Engineering, Mechanical Engineering, Ceramic Chip Carriers +18

Ultra-Thin Overcoats for the Head/Disk Interface Tribology

Charanjit S. Bhatia, S. Anders, I.G. Brown et al. · Journal of Tribology · 1998 · 43 citations

Materials Science, Surface Technology, Head Disk Interface +15

Hardness and tribochemical evaluation of ultra-thin CH/sub x/ and CN/sub x/ overcoats

Xiaohan Yun, R. Hsiao, David B. Bogy et al. · IEEE Transactions on Magnetics · 1997 · 29 citations

Tribochemical Evaluation, Engineering, Mechanical Engineering +21

Nanomechanical properties of CN/sub x/ overcoats and cathodic arc carbon (CAC) films

R. Hsiao, David B. Bogy, Charanjit S. Bhatia · IEEE Transactions on Magnetics · 1998 · 11 citations

Engineering, Mechanical Engineering, Wear Prevention +18

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