Ting-Yang Yu

Investigation of Pillar–Concave Structure for Low-Temperature Cu–Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration

Tzu-Chieh Chou, Kai-Ming Yang, Jian-Chen Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 19 citations

Engineering, Materials Engineering, Materials Science +13

Grinding characteristics of micro-abrasive pellet tools fabricated by a LIGA-like process

Sen Luo, Ting-Yang Yu, C.Y. Liu et al. · International Journal of Machine Tools and Manufacture · 2008 · 18 citations

Engineering, Manufacturing Engineering, Materials Engineering +13

Low-Temperature Cu–Cu Direct Bonding Using Pillar–Concave Structure in Advanced 3-D Heterogeneous Integration

Yu-Tao Yang, Tzu-Chieh Chou, Ting-Yang Yu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 18 citations

Engineering, Materials Engineering, Materials Science +15

Review of IGBT Junction Temperature Extraction and Estimation Methods

Xinglong Qiu, Gaosheng Zhang, Wanyu Chen et al. · IOP Conference Series Materials Science and Engineering · 2020 · 12 citations · Full text

Engineering, Electrical Engineering, Microelectronics +16

Robust terahertz polarizers with high transmittance at selected frequencies through Si wafer bonding technologies

Ting-Yang Yu, Nai-Chen Chi, Hsin-Cheng Tsai et al. · Optics Letters · 2017 · 10 citations

Engineering, Electrical Engineering, Materials Science +17