Jian-Qiang Chen

Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints

Jian-Qiang Chen, Jingdong Guo, Kai-Lang Liu et al. · Journal of Applied Physics · 2013 · 49 citations · Full text

Engineering, Severe Polarity Effect, Sn Grain Orientation +16

Reliability and failure mechanism of copper pillar joints under current stressing

Hui-Cai Ma, Jingdong Guo, Jian-Qiang Chen et al. · Journal of Materials Science Materials in Electronics · 2015 · 30 citations

Materials Science, Structural Integrity, Engineering +10

Electromigration anisotropy introduced by tin orientation in solder joints

Jian-Qiang Chen, Kai-Lang Liu, Jingdong Guo et al. · Journal of Alloys and Compounds · 2017 · 28 citations

Materials Science, Materials Engineering, Electromigration Technique +6

Anti-Lung-Cancer Activity and Liposome-Based Delivery Systems of<i>β</i>-Elemene

Meiwan Chen, Jinming Zhang, Siqin Yu et al. · Evidence-based Complementary and Alternative Medicine · 2012 · 21 citations · Full text

Magnetic-field induced anisotropy in electromigration behavior of Sn–Ag–Cu solder interconnects

Jian-Qiang Chen, Jingdong Guo, Hui-Cai Ma et al. · Journal of materials research/Pratt's guide to venture capital sources · 2015 · 12 citations

Materials Science, Magnetism, Electrical Engineering +6