Concepedia

Kai-Lang Liu

KL

3

Publications

89

Citations

3

H-Index

2013

Active since

Affiliations

University of Illinois Urbana-Champaign(Current)

Chinese Academy of Sciences

Kai-Lang Liu is an author at University of Illinois Urbana-Champaign specializing in electronic packaging, materials science, and engineering.

Top concepts

Publications per year

2013–2017

3

Publications

3

Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints

Jian-Qiang Chen, Jingdong Guo, Kai-Lang Liu et al. · Journal of Applied Physics · 2013 · 49 citations · Full text

, , +16

Electromigration anisotropy introduced by tin orientation in solder joints

Jian-Qiang Chen, Kai-Lang Liu, Jingdong Guo et al. · Journal of Alloys and Compounds · 2017 · 28 citations

, , +6

Magnetic-field induced anisotropy in electromigration behavior of Sn–Ag–Cu solder interconnects

Jian-Qiang Chen, Jingdong Guo, Hui-Cai Ma et al. · Journal of materials research/Pratt's guide to venture capital sources · 2015 · 12 citations

, , +6

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