Concepedia

Hui-Cai Ma

HM

3

Publications

70

Citations

3

H-Index

2015

Active since

Affiliations

Chinese Academy of Sciences(Current)

University of Illinois Urbana-Champaign

Hui-Cai Ma is an author at Chinese Academy of Sciences specializing in engineering, materials science, and electronic packaging.

Top concepts

Publications per year

2015–2017

3

Publications

3

Reliability and failure mechanism of copper pillar joints under current stressing

Hui-Cai Ma, Jingdong Guo, Jian-Qiang Chen et al. · Journal of Materials Science Materials in Electronics · 2015 · 30 citations

, , +10

Electromigration anisotropy introduced by tin orientation in solder joints

Jian-Qiang Chen, Kai-Lang Liu, Jingdong Guo et al. · Journal of Alloys and Compounds · 2017 · 28 citations

, , +6

Magnetic-field induced anisotropy in electromigration behavior of Sn–Ag–Cu solder interconnects

Jian-Qiang Chen, Jingdong Guo, Hui-Cai Ma et al. · Journal of materials research/Pratt's guide to venture capital sources · 2015 · 12 citations

, , +6

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