Fay Hua

Size-dependent melting properties of tin nanoparticles

Hongjin Jiang, Kyoung‐sik Moon, Hai Dong et al. · Chemical Physics Letters · 2006 · 211 citations

Natural Sciences, Materials Engineering, Materials Science +12

Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders

Hongjin Jiang, Kyoung‐sik Moon, Fay Hua et al. · Chemistry of Materials · 2007 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +17

Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect

Jae-Woong Nah, Jong-ook Suh, K. N. Tu et al. · Journal of Applied Physics · 2006 · 99 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +17

The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

Carl Deppisch, Thomas J. Fitzgerald, Arun Raman et al. · JOM · 2006 · 88 citations

Engineering, Materials Engineering, Materials Science +17

Anomalous Creep in Sn-Rich Solder Joints

Ho nbsp Geon Song, John nbsp W. Morris, Fay Hua · MATERIALS TRANSACTIONS · 2002 · 29 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16