Soung-Soon Chun

Improved TiN film as a diffusion barrier between copper and silicon

Sa‐Kyun Rha, Won‐Jun Lee, Seung Yun Lee et al. · Thin Solid Films · 1998 · 64 citations

Natural Sciences, Materials Engineering, Materials Science +14

Atomic Layer Deposition of TiN Films by Alternate Supply of Tetrakis(ethylmethylamino)-Titanium and Ammonia

Jae-Sik Min, Young-Woong Son, Won-Gu Kang et al. · Japanese Journal of Applied Physics · 1998 · 62 citations

Natural Sciences, Materials Engineering, Materials Science +12

Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO₂/Si multilayer structures

Sa‐Kyun Rha, Won‐Jun Lee, Seung Yun Lee et al. · Journal of materials research/Pratt's guide to venture capital sources · 1997 · 19 citations

Natural Sciences, Materials Engineering, Materials Science +7

Copper chemical vapour deposition using copper(I) hexafluoroacetylacetonate trimethylvinylsilane

Won‐Jun Lee, Jae-Sik Min, Sa‐Kyun Rha et al. · Journal of Materials Science Materials in Electronics · 1996 · 16 citations

Natural Sciences, Chemistry, Materials Science +8

A GaAs power amplifier for 3.3 V CDMA/AMPS dual-mode cellular phones

Sung-Jae Maeng, Soung-Soon Chun, Jong-Lam Lee et al. · IEEE Transactions on Microwave Theory and Techniques · 1995 · 15 citations

Engineering, Electrical Engineering, Analog Electronics +16