T.D. Her

Characterization of molded underfill material for flip chip ball grid array packages

F. Liu, Y.P. Wang, Kevin Tshun Chuan Chai et al. · 2002 · 34 citations

Materials Science, Flip Chip Technology, Engineering +13

Electrical characterization and structure investigation of quad flat non-lead package for RFIC applications

Nansen Chen, Kevin Chiang, T.D. Her et al. · Solid-State Electronics · 2002 · 28 citations

Rfic Applications, Electrical Engineering, Structure Investigation +8

The advent of 3-D package age

L. Wu, Yu-Po Wang, S.C. Kee et al. · 2002 · 14 citations

Engineering, Mechanical Engineering, 3D Modeling +24

Bridging the gap: package level and system level thermal modeling

W. Wang, Sz‐Chian Liou, Yuhao Sun et al. · 2002 · 12 citations

Hardware Modeling, Engineering, Package Level +22