Eugene M. Chow - Concepedia

Author

Eugene M. Chow

Palo Alto Research Center

Also Known As

E Chow, E. M. Chow, E.M Chow, E.M. Chow, Eugene Chow, Eugene M Chow, Eugene M. Chow

Publications

1.6K

Citations

H-Index

Concepts

All Affiliations

Palo Alto Research Center Stanford University Oracle (United States)

About

Eugene M. Chow is an author at Palo Alto Research Center specializing in engineering, microfabrication, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	20	1.4K
2	Applied Physics	11	11	1K
3	Biomedical Engineering	7	7	330
4	Medicine	3	3	89
5	Cell Biology	1	1	58

Eugene M. Chow

Publications

1.5K

Citations

H-Index

Page 1

	Year	Citations
Quality factors in micron- and submicron-thick cantilevers Kevin Yasumura, T. D. Stowe, Eugene M. Chow, Journal of Microelectromechanical Systems Quality FactorsEngineeringMicromechanicsMechanical EngineeringSilicon On Insulator	2000	669
A high-performance planar piezoresistive accelerometer Aaron Partridge, J. K. Reynolds, Benjamin W. Chui, Journal of Microelectromechanical Systems Piezoresistive AccelerometersMicromachined Piezoresistive AccelerometerEngineeringMechanical EngineeringAccelerometer	2000	196
Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates Eugene M. Chow, V. Chandrasekaran, Aaron Partridge, Journal of Microelectromechanical Systems Advanced Packaging3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineering	2002	88
An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays Ching‐Hsiang Cheng, Eugene M. Chow, Xuecheng Jin, AeroacousticsSignal Processing ChipEngineeringInterconnect (Integrated Circuits)Micro-electromechanical System	2002	61
Activity of circular muscle of rat uterus at different times in pregnancy Bengt Bengtsson, Eugene M. Chow, Jean M. Marshall American Journal of Physiology-Cell Physiology	1984	59
Intracellular calcium waves in bone cell networks under single cell nanoindentation. X. Edward Guo, Erica Takai, Xingyu Jiang, PubMed Tissue EngineeringEngineeringCell AdhesionBiofabricationCytoskeleton	2006	58
Integration and Packaging of a Macrochip With Silicon Nanophotonic Links J. E. Cunningham, Ashok V. Krishnamoorthy, Ron Ho, IEEE Journal of Selected Topics in Quantum Electronics EngineeringDevice IntegrationIntegrated PhotonicsOptoelectronic DevicesFiber Optics	2011	49
Integration of through-wafer interconnects with a two-dimensional cantilever array Eugene M. Chow, H. Tom Soh, H.C Lee, Sensors and Actuators A Physical Electrical EngineeringWafer Scale ProcessingEngineeringDevice IntegrationMicrofabrication	2000	38
High voltage thin film transistors integrated with MEMS Eugene M. Chow, Jeng Ping Lu, Jackson Ho, Sensors and Actuators A Physical Electrical EngineeringEngineeringApplied PhysicsSemiconductor Device FabricationThin Film Process Technology	2005	34
Novel packaging with rematable spring interconnect chips for MCM Ivan Shubin, Eugene M. Chow, J. E. Cunningham, Advanced PackagingSpringrdquo IntegrationElectrical EngineeringChip-scale PackageEngineering	2009	33

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