Chin-Chiu Hsia

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Active since

2008

Affiliations

Taiwan Semiconductor Manufacturing Company (Taiwan)(Current)

National Tsing Hua University

Chin-Chiu Hsia is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in fracture toughness, engineering, and mechanical behavior of materials.

Publications per year

2008–2008

Publications

Interfacial Fracture Investigation of Low-k Packaging Using J-Integral Methodology

Chang‐Chun Lee, Tai-Chun Huang, Chin-Chiu Hsia et al. · IEEE Transactions on Advanced Packaging · 2008 · 22 citations

Engineering, Electrical Engineering, Materials Engineering +17

Cracking energy estimation of ultra low-k package using novel prediction approach combined with global–local modeling technique

Chang‐Chun Lee, Tsung-Lin Chou, Chien‐Chia Chiu et al. · Microelectronic Engineering · 2008 · 12 citations

Engineering, Materials Engineering, Materials Science +17

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