Concepedia

Shu Chuan Tseng

SC

2

Publications

29

Citations

2

H-Index

2005

Active since

Affiliations

National Cheng Kung University(Current)

Shu Chuan Tseng is an author at National Cheng Kung University specializing in electronic packaging, engineering, and heat transfer.

Top concepts

EngineeringElectronic PackagingHeat TransferMicrostructureSolid MechanicsMaterial ScienceMicroelectronicsThermal EngineeringElectrical EngineeringMechanical Engineering

Publications per year

2005–2006

2

Publications

2

Effects of solder joint structure and shape on thermal reliability of plastic ball grid array package

R.S. Chen, Shu Chuan Tseng, C.S. Wan · The International Journal of Advanced Manufacturing Technology · 2005 · 15 citations

Solder Joint Structure, Electrical Engineering, Engineering +5

Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package

Shu Chuan Tseng, R. S. Chen, C. C. Lio · The International Journal of Advanced Manufacturing Technology · 2006 · 14 citations

Materials Science, Bump Metallurgy, Chip-scale Package +12

Rows per page

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