Concepedia

C.S. Wan

CW

1

Publications

15

Citations

1

H-Index

2005

Active since

Affiliations

National Cheng Kung University(Current)

C.S. Wan is an author at National Cheng Kung University specializing in electronic packaging, thermal engineering, and electrical engineering.

Top concepts

Publications per year

2005–2005

1

Publications

1

Effects of solder joint structure and shape on thermal reliability of plastic ball grid array package

R.S. Chen, Shu Chuan Tseng, C.S. Wan · The International Journal of Advanced Manufacturing Technology · 2005 · 15 citations

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