Concepedia

C. C. Lio

CC

1

Publications

14

Citations

1

H-Index

2006

Active since

Affiliations

National Cheng Kung University(Current)

C. C. Lio is an author at National Cheng Kung University specializing in mechanics of materials, microelectronics, and electronic packaging.

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Publications per year

2006–2006

1

Publications

1

Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package

Shu Chuan Tseng, R. S. Chen, C. C. Lio · The International Journal of Advanced Manufacturing Technology · 2006 · 14 citations

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