R.L. Shook - Concepedia

Author

R.L. Shook

AT&T (United States)

Also Known As

R. L. Shook, R. Shook, R.L. Shook, Ryan Shook

Publications

371

Citations

H-Index

Concepts

All Affiliations

AT&T (United States)Alcatel Lucent (Germany)

About

R.L. Shook is an author at AT&T (United States) specializing in engineering, electronic packaging, and mechanical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	13	347
2	Health Sciences	2	2	25
3	Applied Physics	2	2	72
4	Biomedical Engineering	1	1	58
5	Chemistry	1	1	77

R.L. Shook

Publications

347

Citations

H-Index

Page 1

	Year	Citations
Sn Corrosion and Its Influence on Whisker Growth John Osenbach, J. M. DeLucca, B. D. Potteiger, IEEE Transactions on Electronics Packaging Manufacturing Materials ScienceMaterials EngineeringCrystal StructureCorrosion TechnologyEngineering	2007	77
Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory John Osenbach, R.L. Shook, B.T. Vaccaro, IEEE Transactions on Electronics Packaging Manufacturing EngineeringMechanical EngineeringBiomedical EngineeringDermatologyCorrosion	2005	58
Moisture sensitivity characterization of plastic surface mount devices using scanning acoustic microscopy R.L. Shook EngineeringMechanical EngineeringAcoustic SensorHumidity SensorDesiccation	1992	40
Diffusion model to derate moisture sensitive surface mount IC's for factory use conditions R.L. Shook, Thorsten Conrad, V.S. Sastry, IEEE Transactions on Components Packaging and Manufacturing Technology Part C Moisture DiffusionEngineeringPlastic PackagesHumidity SensorDiffusion Model	1996	37
Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels R.L. Shook, B.T. Vaccaro, Daniel Gerlach EngineeringEnergy EfficiencyMechanical EngineeringHumidity SensorStructural Engineering	1998	23
Accelerated life performance of moisture damaged plastic surface mount devices R.L. Shook, Thorsten Conrad Accelerated Life PerformanceEngineeringMechanical EngineeringFalse HealingDamage Mechanism	1993	19
Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC's R.L. Shook, V.S. Sastry EngineeringLiquid Metal CoolingMechanical EngineeringPlastic Surface MountDesiccation	2002	16
Diffusion model to derate moisture sensitive surface mount ICs for factory use conditions R.L. Shook, T.R. Conrad, V.S. Sastry, Moisture DiffusionEngineeringMechanical EngineeringPlastic PackagesHumidity Sensor	2002	15
Lead free packaging and Sn-whiskers John Osenbach, R.L. Shook, B.T. Vaccaro, EngineeringMechanical EngineeringLead IdentificationCopper Lead FramesCorrosion	2004	14
Handling of highly-moisture sensitive components-an analysis of low-humidity containment and baking schedules R.L. Shook, J.P. Goodelle IEEE Transactions on Electronics Packaging Manufacturing Advanced PackagingMoisture DiffusionFood PackagingEngineeringHealth Sciences	2000	13

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