Concepedia

M. C. Liao

MC

4

Publications

58

Citations

4

H-Index

2005

Active since

Affiliations

Inventec (Taiwan)(Current)

Chang Gung University

M. C. Liao is an author at Inventec (Taiwan) specializing in engineering, mechanical engineering, and materials science.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMicrostructureSolid MechanicsMechanical BehaviorElectronic PackagingMechanics Of MaterialsCorrosionThermal Engineering

Publications per year

2005–2024

4

Publications

4

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

M. C. Liao, Pu-Shan Huang, Yi-Hsien Lin et al. · Applied Sciences · 2017 · 22 citations · Full text

Engineering, Mechanical Engineering, Printed Circuit Board +17

The behavior of electroplated hard-chromium on Cr–Mo steel subject to long-term annealing at 250°C

Ching An Huang, Kangxue Li, Weitao Lin et al. · Materials Science and Engineering A · 2005 · 15 citations

Materials Engineering, Materials Science, Cr–mo Steel Subject +8

Warpage and curvature determination of PCB with DIMM socket during reflow process by strain gage measurement

P. S. Huang, Yi-Chieh Lin, Chen‐Yu Huang et al. · 2010 · 11 citations

Pcb Warpage, Engineering, Strain Gage Measurement +16

Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue

Junjie Zhao, Jun Wu, Jiayu Zhang et al. · Journal of Materials Research and Technology · 2024 · 10 citations · Full text

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