Concepedia

Yi-Chieh Lin

YL

2

Publications

29

Citations

2

H-Index

2005

Active since

Affiliations

Chang Gung University(Current)

Yi-Chieh Lin is an author at Chang Gung University specializing in mechanical engineering, solid mechanics, and engineering.

Top concepts

EngineeringSolid MechanicsMaterial ScienceElectronic PackagingMechanical EngineeringMechanics Of MaterialsHeat TransferRefrigerationMicrostructureMicroelectronics

Publications per year

2005–2010

2

Publications

2

Thermal deformations and stresses of flip-chip BGA packages with low- and high-T/sub g/ underfills

Yi-Chieh Lin, Chen‐Yu Huang, J.D. Wu · IEEE Transactions on Electronics Packaging Manufacturing · 2005 · 18 citations

Engineering, Mechanical Engineering, Flip-chip Bga Packages +20

Warpage and curvature determination of PCB with DIMM socket during reflow process by strain gage measurement

P. S. Huang, Yi-Chieh Lin, Chen‐Yu Huang et al. · 2010 · 11 citations

Pcb Warpage, Engineering, Strain Gage Measurement +16

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