Concepedia

Yi-Hsien Lin

YL

1

Publications

22

Citations

1

H-Index

2017

Active since

Affiliations

Inventec (Taiwan)(Current)

Yi-Hsien Lin is an author at Inventec (Taiwan) specializing in mechanics of materials, electrical engineering, and solid mechanics.

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Publications per year

2017–2017

1

Publications

1

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

M. C. Liao, Pu-Shan Huang, Yi-Hsien Lin et al. · Applied Sciences · 2017 · 22 citations · Full text

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