Ho‐Ming Tong

Novel Cu-to-Cu Bonding With Ti Passivation at 180$^{\circ}{\rm C}$ in 3-D Integration

Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng et al. · IEEE Electron Device Letters · 2013 · 104 citations

Novel Cu-to-cu Bonding, Engineering, Inner Cu +18

CPS 768 Formation of anisotropic ice-agar composites by directional freezing

Ho‐Ming Tong, Isao Noda, Carl C. Gryte · Colloid & Polymer Science · 1984 · 56 citations

Materials Science, Materials Engineering, Cps 768 +6

TSV technology for 2.5D IC solution

Meng-Jen Wang, Chang-Ying Hung, Chin‐Li Kao et al. · 2012 · 52 citations

Materials Engineering, Silicon Via, Electrical Engineering +14

On the mechanism of dewatering colloidal aqueous solutions by freeze-thaw processes

Godson Ezekwo, Ho‐Ming Tong, Carl C. Gryte · Water Research · 1980 · 35 citations

Materials Science, Colloid Chemistry, Colloidal Material +9

Microelectronics packaging: present and future

Ho‐Ming Tong · Materials Chemistry and Physics · 1995 · 32 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +7