Concepedia

Jian-Ku Shang

JS

Statistics

Publications

7

Citations

320

H-Index

7

Active since

2005

Affiliations

University of Illinois Urbana-Champaign(Current)

Chinese Academy of Sciences

Jian-Ku Shang is an author at University of Illinois Urbana-Champaign specializing in materials science, materials engineering, and natural sciences.

Publications per year

2005–2018

7

Publications

7

Ultrahigh hardness and high electrical resistivity in nano-twinned, nanocrystalline high-entropy alloy films

Wenyi Huo, Xiaodong Liu, Shuyong Tan et al. · Applied Surface Science · 2018 · 116 citations

Natural Sciences, Materials Engineering, Materials Science +13

In situ Transmission Electron Microscopy Studies of Electric-field-induced Phenomena in Ferroelectrics

Xiaoli Tan, Hui He, Jian-Ku Shang · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 55 citations

Natural Sciences, Materials Science, Physics +14

Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints

Jian-Qiang Chen, Jingdong Guo, Kai-Lang Liu et al. · Journal of Applied Physics · 2013 · 50 citations · Full text

Engineering, Materials Engineering, Materials Science +15

The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

Cai‐Fu Li, Zhi‐Quan Liu, Jian-Ku Shang · Journal of Alloys and Compounds · 2012 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +14

Electromigration anisotropy introduced by tin orientation in solder joints

Jian-Qiang Chen, Kai-Lang Liu, Jingdong Guo et al. · Journal of Alloys and Compounds · 2017 · 29 citations

Engineering, Materials Engineering, Materials Science +10

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