J.N. Sweet - Concepedia

Author

J.N. Sweet

Also Known As

J Sweet, J. N. Sweet, J. Sweet, J.N. Sweet, JAMES SWEET, Jacob Sweet, James N. Sweet, Luu Nguyen, Stephen DeWitt, Sweet, J.

Publications

906

Citations

H-Index

Concepts

All Affiliations

Sandia National Laboratories Sandia National Laboratories California Lawrence Berkeley National Laboratory Texas Instruments (United States)

About

J.N. Sweet is an author at Sandia National Laboratories specializing in engineering, electronic packaging, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	15	609
2	Applied Physics	4	4	111
3	Computer Engineering	4	4	173
4	Chemical Engineering	1	1	10
5	Chemistry	1	1	10

J.N. Sweet

Publications

609

Citations

H-Index

Page 1

	Year	Citations
Thermal conductivity of Inconel 718 and 304 stainless steel J.N. Sweet, E.P. Roth, M. Moss International Journal of Thermophysics Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringThermodynamics	1987	147
A single-chip, 1.6-billion, 16-b MAC/s multiprocessor DSP B. Ackland, A. Anesko, D. Brinthaupt, IEEE Journal of Solid-State Circuits Hardware SecuritySystem On ChipEngineeringHigh-performance ArchitectureComputer Engineering	2000	114
The spectral similarity scale and its application to the classification of hyperspectral remote sensing data J.N. Sweet Environmental MonitoringEngineeringMultispectral ImagingSpectral Similarity ScaleImage Analysis	2004	58
An evaluation of atmospheric correction techniques using the spectral similarity scale J. C. Granahan, J.N. Sweet ClimatologyMeteorologyPrecision AgricultureEnvironmental MonitoringEngineering	2002	50
Optical modeling and aging characteristics of thermally stable black chrome solar selective coatings J.N. Sweet, R. B. Pettit, M. B. Chamberlain Solar Energy Materials Materials ScienceOptical MaterialsEngineeringThermal Barrier CoatingOptical Properties	1984	34
Externally Shunted Josephson Junctions: Generalized Weak Links Paul K. Hansma, Gene I. Rochlin, J.N. Sweet Physical review. B, Solid state Device ModelingJosephson JunctionsElectrical EngineeringEngineeringPhysics	1971	33
Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle D.W. Peterson, S.N. Burchett, J.N. Sweet, EngineeringMechanical EngineeringAtc4.2 Test VehicleThermomechanical StressesAdvanced Packaging (Semiconductors)	2003	33
Microwave-Photon-Assisted Tunneling in Sn-I-Sn Superconducting Tunnel Junctions J.N. Sweet, Gene I. Rochlin Physical review. B, Solid state Microwave-photon-assisted TunnelingSuperconducting MaterialEngineeringCavity QedJunction Resistance	1970	23
Short and long loop manufacturing feedback using a multisensor assembly test chip J.N. Sweet, Melanie R. Tuck, D.W. Peterson, IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringIntegrated CircuitsHardware SystemsAssembled Ic DegradationReliability Engineering	1991	23
Ion-backscattering analysis of tungsten films on heavily doped SiGe J. A. Borders, J.N. Sweet Journal of Applied Physics Materials EngineeringMaterials ScienceSemiconductorsIon ImplantationEngineering	1972	21

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