Electrical and optical properties of gallium-doped zinc oxide films deposited by dc magnetron sputtering

Pung Keun Song, M. Watanabe, Masato Kon, +2

Thin Solid Films

Materials ScienceElectrical EngineeringOptical MaterialsEngineeringNanoelectronics +9

Uniaxial locked growth of high-quality epitaxial ZnO films on -Al2O3

Paul Fons, K. Iwata, Shigeru Niki, +3

Journal of Crystal Growth

Materials EngineeringMaterials ScienceAluminium NitrideEngineeringOxide Electronics +4

Epitaxial growth of ZnO thin films on LiNbO3 substrates

Koji Matsubara, Paul Fons, A. Yamada, +2

Thin Solid Films

Materials EngineeringMaterials ScienceEngineeringOxide ElectronicsApplied Physics +2

Electrochromic properties of nickel oxide based thin films sputter deposited in the presence of water vapor

S.V. Green, M. Watanabe, Nobuto Oka, +3

Thin Solid Films

Materials ScienceEngineeringOxide ElectronicsSurface ScienceApplied Physics +8

Performance of a 7-mm microfabricated car

A. Teshigahara, M. Watanabe, N. Kawahara, +2

Journal of Microelectromechanical Systems

Automotive EngineeringEngineeringMechanical Engineering7-Mm-scale Miniature CarMicroactuator +15

Reactive-gas-flow sputter deposition of amorphous WO3 films for electrochromic devices

Nobuto Oka, M. Watanabe, Kaoru Sugie, +3

Thin Solid Films

Materials ScienceElectrical EngineeringEngineeringSurface ScienceApplied Physics +7

A 1.25-Gb/s CMOS burst-mode optical transceiver for ethernet PON system

Kazuko Nishimura, Hiroshi Kimura, M. Watanabe, +6

IEEE Journal of Solid-State Circuits

Free-space Optical NetworkPhotonicsOptical TransmitterEngineeringOptical Transmission System +9

Growth of hydrogenated amorphous silicon carbide films from hydrocarbon gas of methane series mixed with silane and their properties

Shugo Nitta, Akitsugu Hatano, Mayu Yamada, +2

Journal of Non-Crystalline Solids

Materials ScienceMaterials EngineeringChemical EngineeringEngineeringSurface Science +8

Development of 30 micron Pitch Bump Interconnections for COC-FCBGA

Takeo Iwasaki, M. Watanabe, Shinji Baba, +4

Materials ScienceElectrical EngineeringFlip-chip Bonding TechnologyEngineeringFlip-chip Bga Package +12

Two‐Step Thermal Anneal and Its Application to a CCD Sensor and CMOS LSI

M. Ogino, T. Usami, M. Watanabe, +2

Journal of The Electrochemical Society

Chemical EngineeringEngineeringPhysicsCcd SensorCmos Lsi +13