Concepedia

David Hillman

DH

5

Publications

82

Citations

5

H-Index

1987

Active since

Affiliations

Rockwell Automation (United States)(Current)

Iowa State University

David Hillman is an author at Rockwell Automation (United States) specializing in materials science, engineering, and electronic packaging.

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Publications per year

1987–2019

5

Publications

5

Into Africa: the telemedicine links between Canada, Kenya and Uganda.

Macgeorge House, Erin Keough, David Hillman et al. · PubMed · 1987 · 29 citations · Full text

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Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys

André M. Delhaise, Polina Snugovsky, Jeff Kennedy et al. · Journal of Electronic Materials · 2019 · 17 citations

, , +5

Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

Iver E. Anderson, Adam Boesenberg, J. L. Harringa et al. · Journal of Electronic Materials · 2011 · 16 citations

, , +11

Characterization of tin oxidation products using sequential electrochemical reduction analysis (SERA)

David Hillman, L.S. Chumbley · Soldering and Surface Mount Technology · 2006 · 10 citations

Production Validation of SERA Solderability Test Method

Dennis Tench, M. Kendig, D. P. Anderson et al. · Soldering and Surface Mount Technology · 1993 · 10 citations

, , +17

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