Concepedia

Kunihiko NISHI

KN

Statistics

Publications

6

Citations

383

H-Index

6

Active since

1979

Affiliations

Hitachi (Japan)(Current)

Kunihiko NISHI is an author at Hitachi (Japan) specializing in electronic packaging, materials science, and engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingPlasticityMechanical EngineeringMechanics Of MaterialsSolid MechanicsAdvanced PackagingMicroelectronicsMechanical Behavior

Publications per year

1979–2003

6

Publications

6

Analysis of Package Cracking During Reflow Soldering Process

Makoto Kitano, A. Nishimura, Sueo KAWAI et al. · Reliability physics · 1988 · 181 citations

Materials Science, Moisture Saturation, Engineering +13

Analysis of package cracking during reflow soldering process

Masaharu Kitano, A. Nishimura, Sueo KAWAI et al. · 2003 · 115 citations

Moisture Saturation, Engineering, Mechanical Engineering +16

Moisture-Induced Aluminum Corrosion and Stress on the Chip in Plastic-Encapsulated LSIs

H. Inayoshi, Kunihiko NISHI, Shinji OKIKAWA et al. · Reliability physics · 1979 · 33 citations

Materials Science, Advanced Packaging, Materials Engineering +15

Development and application of the stress sensing test chip for IC plastic packages.

Hideo Miura, A. Nishimura, Sueo KAWAI et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 1987 · 26 citations · Full text

Engineering, Si Chip, Integrated Circuits +22

A study of package cracking during the reflow soldering process.

Makoto Kitano, Sueo KAWAI, A. Nishimura et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 1989 · 18 citations · Full text

Materials Science, Advanced Packaging, Reflow Soldering +15

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