Concepedia

Bryan Pu

BP

2

Publications

28

Citations

2

H-Index

1996

Active since

Affiliations

Applied Materials (United States)(Current)

Bryan Pu is an author at Applied Materials (United States) specializing in electronic packaging, microfabrication, and electrical engineering.

Top concepts

EngineeringMicroelectronicsMicrofabricationElectronic PackagingElectrical InsulationElectrical Engineering3D PrintingPulse PowerMaterial ScienceAdvanced Packaging

Publications per year

1996–1996

2

Publications

2

Process kit and wafer temperature effects on dielectric etch rate and uniformity of electrostatic chuck

Hongching Shan, Bryan Pu, Gao Hua et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 18 citations

Process Kit, Electrical Engineering, Engineering +12

M<i>x</i>P+: A new dielectric etcher with enabling technology, high productivity, and low cost-of-consumables

Hongching Shan, Evans Lee, Michael Welch et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1996 · 10 citations

High Productivity, Mxp Chamber, Engineering +20

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