Concepedia

Charles Woychik

CW

Statistics

Publications

6

Citations

105

H-Index

6

Active since

1988

Affiliations

Stanford University(Current)

General Electric (United States)

Endicott College

GE Global Research (United States)

Charles Woychik is an author at Stanford University specializing in engineering, chip packaging, and microelectromechanical systems.

Publications per year

1988–2023

6

Publications

6

Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry

Yifan Guo, Charles Woychik · Journal of Electronic Packaging · 1992 · 23 citations

Engineering, Materials Engineering, Materials Science +17

Multi-row linear cMUT array using cMUTs and multiplexing electronics

Robert Wodnicki, Charles Woychik, Albert T. Byun et al. · 2009 · 21 citations

Engineering, Electrical Engineering, Biomedical Imaging +15

Embedded Chip Build-Up Using Fine Line Interconnect

Ray Fillion, Charles Woychik, Tan Zhang et al. · 2007 · 19 citations

Engineering, Computer Engineering, Electrical Engineering +17

Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays

Der-Song Lin, Robert Wodnicki, Xuefeng Zhuang et al. · IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control · 2013 · 18 citations

Medicine, Biomedical Engineering, Microelectromechanical Systems +13

US Microelectronics Packaging Ecosystem: Challenges and Opportunities

Rouhan Noor, Himanandhan Reddy Kottur, Patrick J Craig et al. · arXiv (Cornell University) · 2023 · 13 citations · Full text

Engineering, Design, Supply Chain Management +16

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