Statistics
Publications
2
Citations
39
H-Index
2
Active since
2002
Affiliations
General Electric (United States)(Current)
Ray Fillion is an author at General Electric (United States) specializing in electronic packaging, electrical engineering, and computer engineering.
Publications per year
2002–2007
2
2
A new power module packaging technology for enhanced thermal performance
B. Ozmat, C.S. Korman, Paul A. McConnelee et al. · 2002 · 20 citations
Embedded Chip Build-Up Using Fine Line Interconnect
Ray Fillion, Charles Woychik, Tan Zhang et al. · 2007 · 19 citations
Engineering, Computer Architecture, Interconnection Network Architecture +17
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