Concepedia

B. Ozmat

BO

7

Publications

239

Citations

7

H-Index

1991

Active since

Affiliations

Texas Instruments (United States)(Current)

GE Global Research (United States)

B. Ozmat is an author at Texas Instruments (United States) specializing in engineering, electronic packaging, and heat transfer.

Top concepts

EngineeringHeat TransferThermal EngineeringElectronic PackagingMicroelectronicsComputer EngineeringElectrical EngineeringThermodynamicsMaterial ScienceAdvanced Packaging

Publications per year

1991–2004

7

Publications

7

Thermal Applications of Open-Cell Metal Foams

B. Ozmat, Bryan Leyda, Burton Benson · Materials and Manufacturing Processes · 2004 · 106 citations

Materials Science, Reticulated Metal Foams, Thermal Applications +14

Growth modes of cracks in creeping type 304 stainless steel

B. Ozmat, A. S. Argon, David M. Parks · Mechanics of Materials · 1991 · 47 citations

Materials Science, Engineering, Mechanical Engineering +7

Interconnect technologies and the thermal performance of MCM

B. Ozmat · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 23 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +17

A new power module packaging technology for enhanced thermal performance

B. Ozmat, C.S. Korman, Paul A. McConnelee et al. · 2002 · 20 citations

Engineering, Energy Efficiency, Power Electronics +19

A nonlinear thermal stress analysis of surface mount solder joints

B. Ozmat · 2002 · 18 citations

Friction Welding, Engineering, Mechanical Engineering +21

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