David Chang

Development and characterization of new generation panel fan-out (P-FO) packaging technology

Hong-Da Chang, David Chang, Kenny Liu et al. · 2014 · 56 citations

Engineering, Electrical Engineering, Microfabrication +15

The study of OSP as reliable surface finish of BGA substrate

David Chang, Fengsong Bai, Y.P. Wang et al. · 2005 · 21 citations

Engineering, Materials Engineering, Materials Science +13

Innovative fan-out wafer level package using lamination process and adhered Si wafer on the backside

H. S. Hsu, David Chang, Kenny Liu et al. · 2012 · 13 citations

Engineering, Materials Engineering, Materials Science +15

Advantage and challenge of coreless flip-chip BGA

Elva Lin, David Chang, Don-Son Jiang et al. · 2007 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +16

Flux study for ultra fine pitch flip chip packages

Wen-Hao Lee, G. T. Lin, David Chang et al. · 2009 · 10 citations

Engineering, Materials Engineering, Materials Science +16