Statistics
Publications
2
Citations
26
H-Index
2
Active since
2006
Affiliations
Jeng Lai is an author at Siliconware Precision Industries (Taiwan) specializing in advanced packaging, packaging engineering, and electronic materials.
Publications per year
2006–2006
2
2
Stress and Thermal Characteristic Analyses for Advanced FCBGA Packages
Yuan Lin Tzeng, Eason Chen, Jeng Lai et al. · 2006 · 15 citations
Engineering, Electrical Engineering, Materials Engineering +17
1–2 of 2