Andrew H. Loomis

Three-dimensional integrated circuits for low-power, high-bandwidth systems on a chip

J.A. Burns, L.G. McIlrath, C.L. Keast et al. · 2002 · 162 citations

Engineering, Vlsi Design, Computer Architecture +20

Layer-by-layer deposition of oppositely charged polyelectrolytes on the surface of condensed DNA particles

V.S. Trubetskoy, Andrew H. Loomis, James E. Hagstrom et al. · Nucleic Acids Research · 1999 · 100 citations · Full text

Engineering, Layer-by-layer Deposition, Smart Polymer +18

Soft-X-ray CCD imagers for AXAF

Barry E. Burke, James A. Gregory, M. W. Bautz et al. · IEEE Transactions on Electron Devices · 1997 · 94 citations

X-ray Spectroscopy, Engineering, Microscopy +20

Laser Radar Imager Based on 3D Integration of Geiger-Mode Avalanche Photodiodes with Two SOI Timing Circuit Layers

Brian F. Aull, J.A. Burns, C. Chen et al. · 2006 · 56 citations

Engineering, Geiger-mode Avalanche Photodiodes, Image Sensor +18

Three-dimensional imaging with arrays of Geiger-mode avalanche photodiodes

Brian F. Aull, Andrew H. Loomis, Douglas Young et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2004 · 43 citations

Photonics, Engineering, Time-of-flight Camera +15