Yung-Shou Cheng

Design of Microstrip-to-Microstrip Via Transition in Multilayered LTCC for Frequencies up to 67 GHz

Chih-Chun Tsai, Yung-Shou Cheng, Ting-Yi Huang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 64 citations

Engineering, Electrical Engineering, Antennas +16

Enhanced Microstrip Guard Trace for Ringing Noise Suppression Using a Dielectric Superstrate

Yung-Shou Cheng, Wei-Da Guo, Chih-Pin Hung et al. · IEEE Transactions on Advanced Packaging · 2010 · 31 citations · Full text

Engineering, Electrical Engineering, Circuit Theory +16

Signal/Power Integrity Modeling of High-Speed Memory Modules Using Chip-Package-Board Coanalysis

Hao-Hsiang Chuang, Wei-Da Guo, Yu-Hsiang Lin et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 31 citations

Engineering, Computer Engineering, Electrical Engineering +17

Direct Eye Diagram Optimization for Arbitrary Transmission Lines Using FIR Filter

Yung-Shou Cheng, Ruey‐Beei Wu · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 21 citations

Engineering, Systems Engineering, Machine Vision +12

Fewest vias design for microstrip guard trace by using overlying dielectric

Yung-Shou Cheng, Wei-Da Guo, Guang-Hwa Shiue et al. · 2008 · 20 citations

Engineering, Electrical Engineering, Microelectronics +14