Keiji Miyachi

Pad flattening ratio, coefficient of friction and removal rate analysis during silicon dioxide chemical mechanical planarization

H. Lee, Yong Zhuang, Masano Sugiyama et al. · Thin Solid Films · 2009 · 24 citations

Engineering, Materials Engineering, Materials Science +14

Silicon Wafer Cleaning Using New Liquid Aerosol with Controlled Droplet Velocity and Size by Rotary Atomizer Method

Yoshiyuki Seike, Keiji Miyachi, Tatsuo Shibata et al. · Japanese Journal of Applied Physics · 2010 · 23 citations

Engineering, Materials Engineering, Materials Science +14

Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical Planarization

Yoshiyuki Seike, Darren DeNardis, Masano Sugiyama et al. · Japanese Journal of Applied Physics · 2005 · 19 citations

Engineering, Materials Engineering, Materials Science +13

Investigation of high-pressure micro jet technology as an alternative to diamond disc conditioning in ILD CMP

Darren DeNardis, Yoshiyuki Seike, Mineo Takaoka et al. · Wear · 2005 · 12 citations

Engineering, Materials Engineering, Mechanical Engineering +3

Development of a Pad Conditioning Process for Interlayer Dielectric CMP Using High-Pressure Micro Jet Technology

Yoshiyuki Seike, Hyo-sang Lee, Mineo Takaoka et al. · Journal of The Electrochemical Society · 2006 · 10 citations

Engineering, Materials Engineering, Materials Science +16