Matiar R. Howlader

Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder

Yinghui Wang, Matiar R. Howlader, Kenji Nishida et al. · MATERIALS TRANSACTIONS · 2005 · 33 citations · Full text

Engineering, Room Temperature Bonding, Oxidation Resistance +20

Sequential Plasma Activated Process for Silicon Direct Bonding

Matiar R. Howlader, Hironori Itoh, Tadatomo Suga et al. · ECS Transactions · 2006 · 24 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Nanobonding for Multi-Junction Solar Cells at Room Temperature

Tian Yu, Matiar R. Howlader, Fangfang Zhang et al. · ECS Transactions · 2011 · 17 citations

Engineering, Organic Solar Cell, Semiconductor Materials +19

Comparative Electrochemical Investigation of Pt, Au and Ti Electrodes on Liquid Crystal Polymer for the Application of Neuromuscular Prostheses

Saba Mohtashami, Matiar R. Howlader, Thomas E. Doyle · ECS Transactions · 2011 · 11 citations

Engineering, Electrode-electrolyte Interface, Implantable Electrodes +17