J. W. Ronnie Teo

Publications

303

Citations

H-Index

2007

Active since

Affiliations

Singapore Institute of Manufacturing Technology(Current)

Nanyang Technological University

Agency for Science, Technology and Research

J. W. Ronnie Teo is an author at Singapore Institute of Manufacturing Technology specializing in engineering, electronic packaging, and microstructure.

Top concepts

EngineeringMicrostructureMaterial ScienceElectronic PackagingMaterials EngineeringMechanics Of MaterialsApplied PhysicsMedicineChromatinCell Death

Publications per year

2007–2022

Publications

High-temperature creep and hardness of eutectic 80Au/20Sn solder

Y.C. Liu, J. W. Ronnie Teo, S. K. Tung et al. · Journal of Alloys and Compounds · 2007 · 141 citations

Materials Science, Materials Engineering, Engineering +7

Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading

J. W. Ronnie Teo, Yukai Sun · Acta Materialia · 2007 · 87 citations

Materials Science, Materials Engineering, Friction Welding +11

Microstructure of eutectic 80Au/20Sn solder joint in laser diode package

J. W. Ronnie Teo, Fern Lan Ng, L.S. Goi et al. · Microelectronic Engineering · 2007 · 27 citations

Materials Engineering, Materials Science, Advanced Laser Processing +12

222-Nanometer Far-UVC Exposure Results in DNA Damage and Transcriptional Changes to Mammalian Cells

Qunxiang Ong, Winson Wee, Joshua Dela Cruz et al. · International Journal of Molecular Sciences · 2022 · 20 citations · Full text

Ultraviolet Light, Dna Damage, Radiation Effect +20

Thermal Cycling Aging Effect on the Reliability and Morphological Evolution of SnAgCu Solder Joints

J. W. Ronnie Teo · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 17 citations

Engineering, Tbga Component, Structural Materials +20

Rows per page

1–5 of 6