Publication | Closed Access
Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading
87
Citations
14
References
2007
Year
Materials ScienceMaterials EngineeringFriction WeldingEngineeringMechanical EngineeringMetallurgical InteractionPb-free Solder JointsWeld Pool SolidificationElectronic PackagingThermomechanical AnalysisThermomechanical ProcessingMechanics Of MaterialsMicrostructureInterfacial Intermetallic Compounds
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