Concepedia

Jongmyung Kim

JK

15

Publications

497

Citations

13

H-Index

2008

Active since

Affiliations

Harbin Institute of Technology(Current)

Cheonan Yonam College

China National Electric Apparatus Research Institute (China)

Shenzhen Institute of Information Technology

University Town of Shenzhen

Jongmyung Kim is an author at Harbin Institute of Technology specializing in engineering, materials science, and microstructure.

Top concepts

EngineeringMaterial ScienceMicrostructureMaterials EngineeringApplied PhysicsMechanical EngineeringUltrasoundHeat TransferThermal EngineeringNanomaterials

Publications per year

2008–2021

15

Publications

15

Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal

Yong Xiao, Hongjun Ji, Mingyu Li et al. · Materials & Design (1980-2015) · 2013 · 89 citations

Materials Science, Engineering, Mechanical Engineering +7

Cu6Sn5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints

Ming Yang, Mingyu Li, Ling Wang et al. · Journal of Electronic Materials · 2010 · 63 citations

Materials Science, Materials Engineering, Friction Welding +9

Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn–Al hypereutectic filler metal

Yong Xiao, Hongjun Ji, Mingyu Li et al. · Materials & Design (1980-2015) · 2013 · 45 citations

Materials Science, Materials Engineering, Al Alloy Joints +7

Textured growth of Cu6Sn5 grains formed at a Sn3.5Ag/Cu interface

Mingyu Li, Ming Yang, Jongmyung Kim · Materials Letters · 2011 · 41 citations

Materials Science, Materials Engineering, Engineering +8

Eddy Current Induced Heating for the Solder Reflow of Area Array Packages

Mingyu Li, Hongbo Xü, S. W. Ricky Lee et al. · IEEE Transactions on Advanced Packaging · 2008 · 41 citations

Electrical Engineering, Engineering, Solder Reflow +10

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