Jun Liang

New Three-Dimensional Integration Technology Based on Reconfigured Wafer-on-Wafer Bonding Technique

Takafumi Fukushima, Hirokazu Kikuchi, Yusuke Yamada et al. · 2007 · 94 citations

Engineering, Device Integration, Integration Technology +16

Towards printed perovskite solar cells with cuprous oxide hole transporting layers: a theoretical design

Yan Wang, Zhonggao Xia, Jun Liang et al. · Semiconductor Science and Technology · 2015 · 90 citations · Full text

CdS-Nanowires Flexible Photo-detector with Ag-Nanowires Electrode Based on Non-transfer Process

Yanli Pei, Ruihan Pei, Xiaoci Liang et al. · Scientific Reports · 2016 · 83 citations · Full text

Effect of channel thickness on electrical performance of amorphous IGZO thin-film transistor with atomic layer deposited alumina oxide dielectric

Yufan Li, Yanli Pei, R.Q. Hu et al. · Current Applied Physics · 2014 · 79 citations

Materials Science, Electrical Engineering, Engineering +8

Controllable-morphology polymer blend photonic metafoam for radiative cooling

Yajie Wang, Tiecheng Wang, Jun Liang et al. · Materials Horizons · 2023 · 62 citations