Preparation of CsSnBr3 perovskite film and its all-inorganic solar cells with planar heterojunction

Fang Dong, Yu Tong, Futing Xu, +3

Journal of Solid State Chemistry

Materials ScienceChemical EngineeringEngineeringPerovskite Solar CellOrganic Solar Cell +8

An integrated wearable differential microneedle array for continuous glucose monitoring in interstitial fluids

Yong Yang, Can Sheng, Fang Dong, +1

Biosensors and Bioelectronics

EngineeringImplantable SensorMicrofabricationWearable ElectronicsWearable Technology +5

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, +2

Journal of Electronic Packaging

EngineeringIndustrial EngineeringLife PredictionMechanical EngineeringFatigue +15

Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface

Chaoyue Ji, Xintian Cai, Zhen Zhou, +3

Materials & Design

Imc LayerEngineeringSevere Plastic DeformationMechanical EngineeringSilicon On Insulator +20

Deep neural network for designing near- and far-field properties in plasmonic antennas

Qingxin Wu, Xiaozhong Li, Li Jun Jiang, +7

Optical Materials Express

EngineeringNano-opticsPlasmonic AntennasElectromagnetic MetamaterialsMagnetoplasmonics +15

Study of deformation mechanism of structural anisotropy in 4H–SiC film by nanoindentation

Lianghao Xue, Gan Feng, Gai Wu, +5

Materials Science in Semiconductor Processing

Materials ScienceEngineeringDeformation MechanismApplied PhysicsThin Films +5

Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices

Yuexin Zhang, Shizhao Wang, Fang Dong, +7

Micromachines

Analysis of Size-Dependent Linear Static Bending, Buckling, and Free Vibration Based on a Modified Couple Stress Theory

Feixiang Tang, Siyu He, Shaonan Shi, +3

Materials

EngineeringMechanicsFree VibrationMechanical EngineeringCivil Engineering +13

A thermomechanical constitutive model for investigating the fatigue behavior of Sn‐rich solder under thermal cycle loading

Zhao Zhang, Sheng Liu, Kun Ma, +4

Fatigue & Fracture of Engineering Materials & Structures

EngineeringMechanical EngineeringThermal Cycle LoadingStructural MaterialsMechanics Modeling +19

Size-Dependent Buckling and Post-Buckling Analysis of the Functionally Graded Thin Plate Al–Cu Material Based on a Modified Couple Stress Theory

Feixiang Tang, Fang Dong, Yuzheng Guo, +3

Nanomaterials