Sheng‐Chih Lin

A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy

Gian Luca Loi, Banit Agrawal, Navin Srivastava et al. · 2006 · 198 citations

Engineering, Vlsi Design, Computer Architecture +19

Cool Chips: Opportunities and Implications for Power and Thermal Management

Sheng‐Chih Lin, Kaustav Banerjee · IEEE Transactions on Electron Devices · 2008 · 100 citations

Engineering, Vlsi Design, Energy Efficiency +21

A self-consistent junction temperature estimation methodology for nanometer scale ICs with implications for performance and thermal management

Kaustav Banerjee, Sheng‐Chih Lin, A. Keshavarzi et al. · 2004 · 68 citations

Engineering, Computer Architecture, Nanometer Scale Ics +23

Introspective 3D chips

Shashidhar Mysore, Banit Agrawal, Navin Srivastava et al. · 2006 · 51 citations

Engineering, Computer Architecture, 3D Modeling +27

A Statistical Framework for Estimation of Full-Chip Leakage-Power Distribution Under Parameter Variations

Hamed F. Dadgour, Sheng‐Chih Lin, Kaustav Banerjee · IEEE Transactions on Electron Devices · 2007 · 50 citations

Engineering, Power Optimization (Eda), Full-chip Leakage-power Distribution +20