Shigeaki Sekiguchi

High-output-power, single-wavelength silicon hybrid laser using precise flip-chip bonding technology

Shinsuke Tanaka, Seok–Hwan Jeong, Shigeaki Sekiguchi et al. · Optics Express · 2012 · 181 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding

T. Matsumoto, T. Kurahashi, Ryotaro Konoike et al. · Journal of Lightwave Technology · 2018 · 102 citations · Full text

Engineering, Electrical Engineering, Optoelectronics +16

22.2 A 25Gb/s hybrid integrated silicon photonic transceiver in 28nm CMOS and SOI

Yanfei Chen, Masaya Kibune, Asako Toda et al. · 2015 · 69 citations

Engineering, Computer Engineering, Electrical Engineering +17

Ultralow-Power (1.59 mW/Gbps), 56-Gbps PAM4 Operation of Si Photonic Transmitter Integrating Segmented PIN Mach–Zehnder Modulator and 28-nm CMOS Driver

Shinsuke Tanaka, T. Simoyama, Tsuyoshi Aoki et al. · Journal of Lightwave Technology · 2018 · 61 citations

Engineering, Electrical Engineering, Low-power Design +16

Cross-Gain Modulation in Quantum-Dot SOA at 1550 nm

G. Contestabile, Akihiro Maruta, Shigeaki Sekiguchi et al. · IEEE Journal of Quantum Electronics · 2010 · 54 citations

Engineering, Electrical Engineering, Optics +16