Tongyu Zhang

Cu Clip-Bonding Method With Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module

Laili Wang, Tongyu Zhang, Fengtao Yang et al. · IEEE Transactions on Power Electronics · 2022 · 75 citations

Engineering, Electrical Engineering, Electronic Materials +16

Direct Integration of Optimized Phase-Change Heat Spreaders Into SiC Power Module for Thermal Performance Improvements Under High Heat Flux

Wei Mu, Laili Wang, Binyu Wang et al. · IEEE Transactions on Power Electronics · 2021 · 47 citations

Engineering, Electrical Engineering, Materials Engineering +17

A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances

Dingkun Ma, Guochun Xiao, Tongyu Zhang et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2022 · 39 citations

Engineering, Electrical Engineering, Heat Transfer +16

Compact-Interleaved Packaging Method of Power Module With Dynamic Characterization of 4H-SiC MOSFET and Development of Power Electronic Converter at Extremely High Junction Temperature

Fengtao Yang, Laili Wang, Hang Kong et al. · IEEE Transactions on Power Electronics · 2022 · 35 citations

Engineering, Electrical Engineering, Materials Science +17

Ultrasonic on-machine scanning for thickness measurement of thin-walled parts: modeling and experiments

Meng Lian, Haibo Liu, Tongyu Zhang et al. · The International Journal of Advanced Manufacturing Technology · 2019 · 28 citations

Medicine, Manufacturing Engineering, Mechanical Engineering +15