Fengtao Yang - Concepedia

Author

Fengtao Yang

Xi'an Jiaotong University ORCID

Also Known As

A Elbe, F Yang, F. H. Yang, F. Yang, Fengtao Yang, Furong Yang, Huaging Li

Publications

879

Citations

H-Index

Concepts

All Affiliations

Xi'an Jiaotong University State Key Laboratory of Electrical Insulation and Power Equipment

About

Fengtao Yang is an author at Xi'an Jiaotong University specializing in electrical engineering, engineering, and power electronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	9	9	422
2	Electrical Engineering	9	9	422
3	Advanced Packaging	3	3	115
4	Applied Physics	2	2	71
5	Computer Engineering	2	2	112

Fengtao Yang

Publications

555

Citations

H-Index

Page 1

	Year	Citations
A Method to Balance Dynamic Current of Paralleled SiC MOSFETs With Kelvin Connection Based on Response Surface Model and Nonlinear Optimization Cheng Zhao, Laili Wang, Fan Zhang, IEEE Transactions on Power Electronics Electrical EngineeringEngineeringPower DeviceKelvin ConnectionParasitic Inductance	2020	72
Cu Clip-Bonding Method With Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module Laili Wang, Tongyu Zhang, Fengtao Yang, IEEE Transactions on Power Electronics Optimized Source InductanceCurrent BalancingElectrical EngineeringCurrent ImbalanceEngineering	2022	70
Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement Fengtao Yang, Lixin Jia, Laili Wang, IEEE Transactions on Power Electronics	2021	64
Thermal Performances and Annual Damages Comparison of MMC Using Reverse Conducting IGBT and Conventional IGBT Module Binyu Wang, Laili Wang, Wei Mu, IEEE Transactions on Power Electronics Annual Damages ComparisonEngineeringMmc SmsPower Electronics ConverterPower Electronic Systems	2021	61
Direct Integration of Optimized Phase-Change Heat Spreaders Into SiC Power Module for Thermal Performance Improvements Under High Heat Flux Wei Mu, Laili Wang, Binyu Wang, IEEE Transactions on Power Electronics Advanced PackagingElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Power Device	2021	44
Air-Cooling System Optimization for IGBT Modules in MMC Using Embedded O-Shaped Heat Pipes Binyu Wang, Laili Wang, Fengtao Yang, IEEE Journal of Emerging and Selected Topics in Power Electronics EngineeringLiquid Metal CoolingEnergy EfficiencyIgbt ModulesPower Electronics	2021	40
A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances Dingkun Ma, Guochun Xiao, Tongyu Zhang, IEEE Journal of Emerging and Selected Topics in Power Electronics EngineeringEnergy EfficiencyPower Electronic SystemsPower ElectronicsCooling System	2022	37
Investigation and Comparison of Temperature-Sensitive Electrical Parameters of SiC mosfet at Extremely High Temperatures Xiaohui Lu, Laili Wang, Qingshou Yang, IEEE Transactions on Power Electronics EngineeringPower ElectronicsSemiconductor DeviceDifferent Temperature RangesThermal Analysis	2023	37
Compact-Interleaved Packaging Method of Power Module With Dynamic Characterization of 4H-SiC MOSFET and Development of Power Electronic Converter at Extremely High Junction Temperature Fengtao Yang, Laili Wang, Hang Kong, IEEE Transactions on Power Electronics EngineeringSilicon CarbidePower Electronic SystemsPower ElectronicsAdvanced Packaging (Semiconductors)	2022	34
A Transient 3-D Thermal Modeling Method for IGBT Modules Considering Uneven Power Losses and Cooling Conditions Jianpeng Wang, Wenjie Chen, Laili Wang, IEEE Journal of Emerging and Selected Topics in Power Electronics EngineeringEnergy EfficiencyIgbt ModulesPower Electronic SystemsPower Electronics	2020	27

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