Concepedia

H. Y. Hsiao

HY

3

Publications

110

Citations

3

H-Index

2008

Active since

Affiliations

National Tsing Hua University(Current)

H. Y. Hsiao is an author at National Tsing Hua University specializing in engineering, thermal engineering, and electronic packaging.

ORCID

Top concepts

Publications per year

2008–2020

3

Publications

3

Improved thermal management of GaN/sapphire light-emitting diodes embedded in reflective heat spreaders

Ray‐Hua Horng, C. C. Chiang, H. Y. Hsiao et al. · Applied Physics Letters · 2008 · 54 citations

, , +15

AI-assisted reliability life prediction model for wafer-level packaging using the random forest method

H. Y. Hsiao, Kuo‐Ning Chiang · Journal of Mechanics · 2020 · 40 citations · Full text

, , +18

Failure Life Prediction of Wafer Level Packaging using DoS with AI Technology

Po-Lun Chou, H. Y. Hsiao, Kuo‐Ning Chiang · 2019 · 16 citations

, , +21

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