Concepedia

Yunfei Du

YD

2

Publications

40

Citations

2

H-Index

2015

Active since

Affiliations

Chongqing University of Technology(Current)

Yunfei Du is an author at Chongqing University of Technology specializing in electronic packaging, mechanical engineering, and materials science.

Top concepts

EngineeringMicrostructureMaterial ScienceElectronic PackagingMechanical EngineeringAlloysHeat TransferSolidificationThermal EngineeringStructural Materials

Publications per year

2015–2021

2

Publications

2

Research and prospect of binary high-temperature Pb-free solders

Yunfei Du, Chuntian Li, Bin Huang et al. · Soldering and Surface Mount Technology · 2015 · 23 citations

Engineering, Mechanical Engineering, Structural Materials +17

Fatigue cracking growth of SAC305 solder ball under rapid thermal shock

Cong Liu, Daquan Xia, Mizhe Tian et al. · Engineering Fracture Mechanics · 2021 · 17 citations

Materials Science, Engineering, Rapid Thermal Shock +9

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